12-inch wafer compatible bump tester SigmaW12
Share of bumps on a maximum 12-inch wafer, the best bond tester for tweezer pull tests.
A multifunctional bond tester ideal for bump shear tests and tweezer pull tests on wafers up to 12 inches. The rotating measurement head eliminates the need for operators to change sensors (load cells). With a stage movement speed of up to 50 mm/sec, a wide range of bumps can be measured in a short time. The rotating shear sensor eliminates the need for wafer rotation. Automation is achieved through an automatic measurement program compatible with pattern recognition. An optional blower and vacuum cleaner can remove residue from the tool tip. A full-auto specification proposal including a wafer transport system is also available.
- Company：テクノアルファ
- Price：Other
